BU200Z-178-HT
On Shore Technology Inc.
Product No:
BU200Z-178-HT
Manufacturer:
Package:
-
Batch:
-
Datasheet:
Description:
CONN IC DIP SOCKET 20POS GOLD
Quantity:
In Stock : Please Inquiry
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Product Information
Parameter Info
User Guide
| Mfr | On Shore Technology Inc. |
| Type | DIP, 0.3" (7.62mm) Row Spacing |
| Series | BU-178HT |
| Package | Bulk |
| Features | Open Frame |
| Termination | Solder |
| Pitch - Post | 0.100" (2.54mm) |
| Mounting Type | Surface Mount |
| Pitch - Mating | 0.100" (2.54mm) |
| Product Status | Obsolete |
| Housing Material | Polybutylene Terephthalate (PBT), Glass Filled |
| Contact Resistance | 7mOhm |
| Base Product Number | BU200Z |
| Contact Finish - Post | Copper |
| Current Rating (Amps) | 1 A |
| Operating Temperature | -55°C ~ 125°C |
| Contact Finish - Mating | Gold |
| Contact Material - Post | Brass |
| Termination Post Length | 0.059" (1.50mm) |
| Contact Material - Mating | Beryllium Copper |
| Material Flammability Rating | UL94 V-0 |
| Contact Finish Thickness - Post | Flash |
| Contact Finish Thickness - Mating | 78.7µin (2.00µm) |
| Number of Positions or Pins (Grid) | 20 (2 x 10) |
2000+Daily average RFQ Volume
30,000,000Standard Product Unit
2800+Worldwide Manufacturers
15,000 ㎡In-stock Warehouse
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