FI-XB30SRL-HF11
JAE Electronics
Product No:
FI-XB30SRL-HF11
Manufacturer:
Package:
-
Batch:
-
Datasheet:
Description:
CONN RCPT 30P 0.039 GOLD SMD R/A
Quantity:
In Stock : Please Inquiry
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Product Information
Parameter Info
User Guide
| Mfr | JAE Electronics |
| Style | Board to Cable/Wire |
| Series | FI-X |
| Package | Bulk |
| Features | Grounding Pins, Shielded, Solder Retention |
| Termination | Solder |
| Applications | General Purpose |
| Contact Type | Non-Gendered |
| Contact Shape | - |
| Mounting Type | Board Cutout, Bottom Mount, Surface Mount, Right Angle, Reverse Mount |
| Connector Type | Receptacle |
| Fastening Type | Friction Lock |
| Number of Rows | 1 |
| Pitch - Mating | 0.039" (1.00mm) |
| Product Status | Obsolete |
| Voltage Rating | 200V |
| Contact Material | Copper Alloy |
| Insulation Color | Black |
| Insulation Height | - |
| Ingress Protection | - |
| Base Product Number | FI-XB30 |
| Insulation Material | Plastic |
| Number of Positions | 30 |
| Row Spacing - Mating | - |
| Contact Finish - Post | Tin |
| Contact Length - Post | - |
| Current Rating (Amps) | 1A per Contact |
| Operating Temperature | -40°C ~ 80°C |
| Mated Stacking Heights | - |
| Contact Finish - Mating | Gold |
| Number of Positions Loaded | All |
| Material Flammability Rating | UL94 V-0 |
| Contact Finish Thickness - Post | - |
| Contact Finish Thickness - Mating | 12.0µin (0.30µm) |
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