HSB06-181810
CUI Devices
Product No:
HSB06-181810
Manufacturer:
Package:
-
Batch:
-
Datasheet:
Description:
HEAT SINK, BGA, 18 X 18 X 10 MM
Quantity:
In Stock : 422
Minimum: 1 Multiples: 1
Qty
Unit Price
1
0.969
10
0.91675
25
0.893
50
0.86868
100
0.820515
250
0.772198
500
0.723938
1000
0.675678
5000
0.651548
Not the price you want? Send RFQ Now and we'll contact you ASAP.
Product Information
Parameter Info
User Guide
| Mfr | CUI Devices |
| Type | Top Mount |
| Shape | Square, Pin Fins |
| Width | 0.709" (18.00mm) |
| Length | 0.709" (18.00mm) |
| Series | HSB |
| Package | Box |
| Diameter | - |
| Material | Aluminum Alloy |
| Fin Height | 0.394" (10.00mm) |
| Package Cooled | BGA |
| Product Status | Active |
| Material Finish | Black Anodized |
| Attachment Method | Adhesive |
| Thermal Resistance @ Natural | 23.68°C/W |
| Power Dissipation @ Temperature Rise | 3.2W @ 75°C |
| Thermal Resistance @ Forced Air Flow | 18.80°C/W @ 200 LFM |
2000+Daily average RFQ Volume
30,000,000Standard Product Unit
2800+Worldwide Manufacturers
15,000 ㎡In-stock Warehouse
Quick Links
