HSB08-212106
CUI Devices
Product No:
HSB08-212106
Manufacturer:
Package:
-
Batch:
-
Datasheet:
Description:
HEAT SINK, BGA, 21 X 21 X 6 MM
Quantity:
In Stock : 1621
Minimum: 1 Multiples: 1
Qty
Unit Price
1
0.8455
10
0.8018
25
0.7619
50
0.74195
100
0.731975
250
0.681834
500
0.641706
1000
0.581552
5000
0.561498
Not the price you want? Send RFQ Now and we'll contact you ASAP.
Product Information
Parameter Info
User Guide
| Mfr | CUI Devices |
| Type | Top Mount |
| Shape | Square, Pin Fins |
| Width | 0.827" (21.00mm) |
| Length | 0.827" (21.00mm) |
| Series | HSB |
| Package | Box |
| Diameter | - |
| Material | Aluminum Alloy |
| Fin Height | 0.236" (6.00mm) |
| Package Cooled | BGA |
| Product Status | Active |
| Material Finish | Black Anodized |
| Attachment Method | Adhesive |
| Thermal Resistance @ Natural | 25.40°C/W |
| Power Dissipation @ Temperature Rise | 3.0W @ 75°C |
| Thermal Resistance @ Forced Air Flow | 9.70°C/W @ 200 LFM |
2000+Daily average RFQ Volume
30,000,000Standard Product Unit
2800+Worldwide Manufacturers
15,000 ㎡In-stock Warehouse
Quick Links
