HSB10-232306
CUI Devices
Product No:
HSB10-232306
Manufacturer:
Package:
-
Batch:
-
Datasheet:
Description:
HEAT SINK, BGA, 23 X 23 X 6 MM
Quantity:
In Stock : 1309
Minimum: 1 Multiples: 1
Qty
Unit Price
1
0.798
10
0.7562
25
0.7182
50
0.69939
100
0.68989
250
0.642656
500
0.604865
1000
0.54816
5000
0.529264
Not the price you want? Send RFQ Now and we'll contact you ASAP.
Product Information
Parameter Info
User Guide
| Mfr | CUI Devices |
| Type | Top Mount |
| Shape | Square, Pin Fins |
| Width | 0.906" (23.00mm) |
| Length | 0.906" (23.00mm) |
| Series | HSB |
| Package | Box |
| Diameter | - |
| Material | Aluminum Alloy |
| Fin Height | 0.236" (6.00mm) |
| Package Cooled | BGA |
| Product Status | Active |
| Material Finish | Black Anodized |
| Attachment Method | Adhesive |
| Thermal Resistance @ Natural | 25.46°C/W |
| Power Dissipation @ Temperature Rise | 3.0W @ 75°C |
| Thermal Resistance @ Forced Air Flow | 9.60°C/W @ 200 LFM |
2000+Daily average RFQ Volume
30,000,000Standard Product Unit
2800+Worldwide Manufacturers
15,000 ㎡In-stock Warehouse
Quick Links
