HSB19-272718
CUI Devices
Product No:
HSB19-272718
Manufacturer:
Package:
-
Batch:
-
Datasheet:
Description:
HEAT SINK, BGA, 27 X 27 X 18 MM
Quantity:
In Stock : 631
Minimum: 1 Multiples: 1
Qty
Unit Price
1
1.8335
10
1.73755
25
1.69176
50
1.64597
100
1.554485
250
1.463038
500
1.37161
1000
1.280163
5000
1.234449
Not the price you want? Send RFQ Now and we'll contact you ASAP.
Product Information
Parameter Info
User Guide
| Mfr | CUI Devices |
| Type | Top Mount |
| Shape | Square, Pin Fins |
| Width | 1.063" (27.00mm) |
| Length | 1.063" (27.00mm) |
| Series | HSB |
| Package | Box |
| Diameter | - |
| Material | Aluminum Alloy |
| Fin Height | 0.709" (18.00mm) |
| Package Cooled | BGA |
| Product Status | Active |
| Material Finish | Black Anodized |
| Attachment Method | Adhesive |
| Thermal Resistance @ Natural | 11.11°C/W |
| Power Dissipation @ Temperature Rise | 6.8W @ 75°C |
| Thermal Resistance @ Forced Air Flow | 4.50°C/W @ 200 LFM |
2000+Daily average RFQ Volume
30,000,000Standard Product Unit
2800+Worldwide Manufacturers
15,000 ㎡In-stock Warehouse
Quick Links
