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HSE-B635-045H

CUI Devices

Product No:

HSE-B635-045H

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Datasheet:

Description:

HEAT SINK, EXTRUSION, TO-220, 63

Quantity:

In Stock : Please Inquiry

Please send RFQ , we will respond immediately.

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Product Information

Parameter Info
User Guide
Mfr CUI Devices
Type Board Level, Vertical
Shape Rectangular, Angled Fins
Width 1.772" (45.00mm)
Length 2.500" (63.50mm)
Series HSE
Package Box
Diameter -
Material Aluminum Alloy
Fin Height 0.500" (12.70mm)
Package Cooled TO-220
Product Status Active
Material Finish Black Anodized
Attachment Method Bolt On and PC Pin
Base Product Number HSE-B635
Thermal Resistance @ Natural 6.41°C/W
Power Dissipation @ Temperature Rise 11.7W @ 75°C
Thermal Resistance @ Forced Air Flow 3.53°C/W @ 200 LFM