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HSE04-251265-2

CUI Devices

Product No:

HSE04-251265-2

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Datasheet:

Description:

HEAT SINK, EXTRUSION, TO-218/TO-

Quantity:

In Stock : 2115

Minimum: 1 Multiples: 1

Qty

Unit Price

  • 1

    0.8265

  • 10

    0.79705

  • 25

    0.77368

  • 50

    0.7277

  • 100

    0.65398

  • 250

    0.644784

  • 500

    0.603326

  • 1000

    0.59412

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Product Information

Parameter Info
User Guide
Mfr CUI Devices
Type Top Mount
Shape Rectangular, Fins
Width 0.472" (12.00mm)
Length 0.984" (25.00mm)
Series HSE
Package Bag
Diameter -
Material Aluminum Alloy
Fin Height 0.256" (6.50mm)
Package Cooled TO-218, TO-220
Product Status Active
Material Finish Black Anodized
Attachment Method Bolt On
Thermal Resistance @ Natural 30.38°C/W
Power Dissipation @ Temperature Rise 2.47W @ 75°C
Thermal Resistance @ Forced Air Flow 16.60°C/W @ 200 LFM