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HSE05-171933

CUI Devices

Product No:

HSE05-171933

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Datasheet:

Description:

HEAT SINK, EXTRUSION, TO-218/TO-

Quantity:

In Stock : 1815

Minimum: 1 Multiples: 1

Qty

Unit Price

  • 1

    1.3395

  • 10

    1.29485

  • 25

    1.25742

  • 50

    1.18256

  • 100

    1.062765

  • 250

    1.047774

  • 500

    0.980419

  • 1000

    0.965447

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Product Information

Parameter Info
User Guide
Mfr CUI Devices
Type Board Level
Shape Rectangular, Angled Fins
Width 0.669" (17.00mm)
Length 0.764" (19.40mm)
Series HSE
Package Box
Diameter -
Material Aluminum Alloy
Fin Height 1.280" (32.50mm)
Package Cooled TO-218, TO-220
Product Status Active
Material Finish Black Anodized
Attachment Method PC Pin
Thermal Resistance @ Natural 18.83°C/W
Power Dissipation @ Temperature Rise 3.98W @ 75°C
Thermal Resistance @ Forced Air Flow 6.90°C/W @ 200 LFM