CUI Devices
Product No:
HSE08-505028
Manufacturer:
Package:
-
Batch:
-
Description:
HEAT SINK, EXTRUSION, TO-218/TO-
Quantity:
Minimum: 1 Multiples: 1
Qty
Unit Price
1
2.337
10
2.2572
25
2.19222
50
2.06169
100
1.852975
250
1.826888
500
1.709449
1000
1.683343
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Mfr | CUI Devices |
Type | Board Level |
Shape | Rectangular, Angled Fins |
Width | 1.102" (28.00mm) |
Length | 1.969" (50.00mm) |
Series | HSE |
Package | Bag |
Diameter | - |
Material | Aluminum Alloy |
Fin Height | 1.969" (50.00mm) |
Package Cooled | TO-218, TO-220 |
Product Status | Active |
Material Finish | Black Anodized |
Attachment Method | Clip |
Thermal Resistance @ Natural | 7.13°C/W |
Power Dissipation @ Temperature Rise | 10.53W @ 75°C |
Thermal Resistance @ Forced Air Flow | 2.70°C/W @ 200 LFM |