HSE11-B20-NP
CUI Devices
Product No:
HSE11-B20-NP
Manufacturer:
Package:
-
Batch:
-
Datasheet:
Description:
HEAT SINK, EXTRUSION, TO-218/TO-
Quantity:
In Stock : Please Inquiry
Please send RFQ , we will respond immediately.
Product Information
Parameter Info
User Guide
| Mfr | CUI Devices |
| Type | Top Mount |
| Shape | Rectangular |
| Width | 0.472" (12.00mm) |
| Length | 0.984" (25.00mm) |
| Series | HSE |
| Package | Bag |
| Diameter | - |
| Material | Aluminum Alloy |
| Fin Height | 0.177" (4.50mm) |
| Package Cooled | TO-218, TO-220 |
| Product Status | Active |
| Material Finish | Black Anodized |
| Attachment Method | Bolt On |
| Thermal Resistance @ Natural | 38.90°C/W |
| Power Dissipation @ Temperature Rise | 1.93W @ 75°C |
| Thermal Resistance @ Forced Air Flow | 21.40°C/W @ 200 LFM |
2000+Daily average RFQ Volume
30,000,000Standard Product Unit
2800+Worldwide Manufacturers
15,000 ㎡In-stock Warehouse
Quick Links
