CUI Devices
Product No:
HSS-C2540-SMT-TR
Manufacturer:
Package:
-
Batch:
-
Description:
HEAT SINK TO-263 COPPER
Quantity:
Minimum: 1 Multiples: 1
Qty
Unit Price
150
1.582196
300
1.489154
450
1.396082
1050
1.303001
7500
1.25646
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Mfr | CUI Devices |
Type | Board Level |
Shape | Rectangular, Fins |
Width | 1.000" (25.40mm) |
Length | 0.763" (19.38mm) |
Series | HSS |
Package | Tape & Reel (TR) |
Diameter | - |
Material | Copper |
Fin Height | 0.450" (11.43mm) |
Package Cooled | TO-263 (D²Pak) |
Product Status | Active |
Material Finish | Tin |
Attachment Method | - |
Base Product Number | HSS-C2540 |
Thermal Resistance @ Natural | 21.90°C/W |
Power Dissipation @ Temperature Rise | 3.8W @ 75°C |
Thermal Resistance @ Forced Air Flow | 5.50°C/W @ 200 LFM |