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HSS19-B20-NP

CUI Devices

Product No:

HSS19-B20-NP

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Datasheet:

Description:

HEAT SINK, STAMPING, TO-218/TO-2

Quantity:

In Stock : 2976

Minimum: 1 Multiples: 1

Qty

Unit Price

  • 1

    0.6175

  • 10

    0.59755

  • 25

    0.58026

  • 50

    0.54568

  • 100

    0.490485

  • 250

    0.483588

  • 500

    0.452504

  • 1000

    0.445588

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Product Information

Parameter Info
User Guide
Mfr CUI Devices
Type Top Mount
Shape Rectangular, Fins
Width 0.748" (19.00mm)
Length 0.866" (22.00mm)
Series HSS
Package Bag
Diameter -
Material Aluminum Alloy
Fin Height 0.748" (19.00mm)
Package Cooled TO-218, TO-220
Product Status Active
Material Finish Black Anodized
Attachment Method Bolt On
Thermal Resistance @ Natural 22.39°C/W
Power Dissipation @ Temperature Rise 3.35W @ 75°C
Thermal Resistance @ Forced Air Flow 8.80°C/W @ 200 LFM