SSW-110-21-H-P
Samtec Inc.
Product No:
SSW-110-21-H-P
Manufacturer:
Package:
-
Batch:
-
Datasheet:
-
Description:
CONN RCPT 10POS 0.1 GOLD PCB
Quantity:
In Stock : Please Inquiry
Please send RFQ , we will respond immediately.
Product Information
Parameter Info
User Guide
| Mfr | Samtec Inc. |
| Style | Board to Board or Cable |
| Series | SSW |
| Package | Bulk |
| Features | - |
| Termination | Solder |
| Applications | - |
| Contact Type | Forked |
| Contact Shape | Square |
| Mounting Type | Through Hole |
| Connector Type | Receptacle |
| Fastening Type | Push-Pull |
| Number of Rows | 1 |
| Pitch - Mating | 0.100" (2.54mm) |
| Product Status | Active |
| Voltage Rating | - |
| Contact Material | Phosphor Bronze |
| Insulation Color | Black |
| Insulation Height | 0.335" (8.51mm) |
| Ingress Protection | - |
| Base Product Number | SSW-110 |
| Insulation Material | Liquid Crystal Polymer (LCP) |
| Number of Positions | 10 |
| Row Spacing - Mating | - |
| Contact Finish - Post | Gold |
| Contact Length - Post | 0.104" (2.64mm) |
| Current Rating (Amps) | 4.7A per Contact |
| Operating Temperature | -55°C ~ 125°C |
| Mated Stacking Heights | - |
| Contact Finish - Mating | Gold |
| Number of Positions Loaded | All |
| Material Flammability Rating | UL94 V-0 |
| Contact Finish Thickness - Post | 3.00µin (0.076µm) |
| Contact Finish Thickness - Mating | 30.0µin (0.76µm) |
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