TS991SNL35T3
Chip Quik Inc.
Product No:
TS991SNL35T3
Manufacturer:
Package:
-
Batch:
-
Datasheet:
Description:
THERMALLY STABLE SOLDER PASTE NC
Quantity:
In Stock : Please Inquiry
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Product Information
Parameter Info
User Guide
| Mfr | Chip Quik Inc. |
| Form | Syringe, 1.23 oz (34.869g) |
| Type | Solder Paste |
| Series | CHIPQUIK® |
| Weight | - |
| Package | Bulk |
| Process | - |
| Diameter | - |
| Flux Type | No-Clean |
| Mesh Type | 3 |
| Shelf Life | 12 Months |
| Wire Gauge | - |
| Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Melting Point | 423°F (217°C) |
| Shipping Info | - |
| Product Status | Active |
| Shelf Life Start | Date of Manufacture |
| Storage/Refrigeration Temperature | 37°F ~ 77°F (3°C ~ 25°C) |
2000+Daily average RFQ Volume
30,000,000Standard Product Unit
2800+Worldwide Manufacturers
15,000 ㎡In-stock Warehouse
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